Electronic devices continue to shrink in size with advancement in chip fabrication technology. Packaging technology has responded with improved formats to present these chips for assembly to PCBs.
SINGAPORE — ST Assembly Test Services Ltd. this week announced availability of a thinner version of its small-thin plastic ball-grid array (STPBGA) package, which reduces the height to 1.2 mm compared ...
Oregon-based TDA Systems has developed a time domain reflectometry (TDR) system to pinpoint faults in ball grid array (BGA) packages. With support from the International Sematech Assembly Analytical ...
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