Frenchtown, N.J. — Aries Electronics has released a new test and burn-in socket that accommodates device packages that measure from 41 to 55 mm 2 in applications up to 1 GHz. The new size, which ...
Aries Electronics has expanded its line of CSP (chip scale package) and MicroBGA (ball grid array) test and burn-in sockets with an optional adjustable pressure pad to include a version that ...
Highway service place operator Applegreen will not be redeveloping and operating 18 state highway service plazas in Massachusetts in a $750 ...
The company's micro BGA and CSP test and burn-in sockets can accept devices measuring up to 13 x 13 mm with a pitch of 0.5 mm or larger in applications operating up to 1 GHz. Both components employ ...
The company's micro BGA and CSP test and burn-in sockets can accept devices measuring 13 x 13 mm with a pitch of 0.5 mm or larger in applications operating up to 1 GHz. Both sockets employ solderless, ...
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