Advanced packaging is transforming semiconductor manufacturing into a multi-dimensional challenge, blending 2D front-end wafer fabrication with 2.5D/3D assemblies, high-frequency device ...

Author Dr. R. Russell Rhinehart discusses his new book, Nonlinear Model-Based Control: Using First-Principles Models in Process Control, and explains why nonlinear first-principles models should be ...

While dynamic modeling is arguably one of the most important technological developments for engineers in the last 50 years, many process control engineers are unable to use it. It requires proper time ...

Vacuum degassing processes in low carbon steel production improve material properties, with real-time gas analysis critical ...