Electromagnetic modelling is fundamental to optimising the design, analysis and operational reliability of transmission lines and cable systems. Contemporary approaches integrate sophisticated ...

Today’s 3D integrated circuit (3D-IC) technology is the culmination of 40 years of research in universities and laboratories scattered across the globe. Beginning with dynamic random-access memory ...

This technical FAQ examines three modeling gaps identified in engineering literature and outlines algorithmic methods to address them.

Innovation in semiconductor design today is energized primarily by AI/ML, data centers, autonomous and electric vehicles, 5G/6G, and IoT. Recently developed 2.5 and 3D-IC silicon-based packaging ...

It seems like yesterday, long before there were handheld GPS units, smart phones and even Google Maps that my staff and I were prepping for another set of proof of performance measurements. Drawing ...