According to foreign media reports, SK Hynix is considering adopting the 2.5D packaging technology "Embedded Multi-die Interconnect Bridge (EMIB)" developed by Intel Corporation (I... Ming-Chi Kuo, an ...

Kinsus Interconnect Technology will strive to grow its business in the FCBGA and AiP packaging fields this year seeking to better cash in on new business opportunities arising from 5G applications in ...

Thermal interface materials (TIMs) have been widely adopted for improved thermal dissipation in flip chip ball grid array (FCBGA), flip chip lidded ball grid array (FCLGA) and flip chip pin grid array ...

Qnity Electronics, Inc. ("Qnity") (NYSE: Q), a premier technology solutions leader across the semiconductor value chain, today announced it received the 2025 ASE Best Supplier Award from ASE ...

Taiwan IC backend service firms have seen increasing flip-chip packaging orders from China chipmaker HiSilicon now actively carrying out volume production of pre-5G chip products, leading to tight ...