Despite strong gains this year, Samsung Electronics and SK Hynix shares are even less expensive than their U.S. counterparts.

The global High Bandwidth Memory (HBM) market is experiencing explosive growth driven by AI demand. The industry is heavily investing in 3D-stacked memory architecture (TSV technology) and advanced ...

Samsung Electronics has started mass production and commercial shipment of its industry first HBM4 high bandwidth memory. The ...

Samsung said it has begun mass production and commercial shipments of a new generation of high-bandwidth memory, called HBM4.

Memory, especially High Bandwidth Memory, plays an important role in ensuring AI workloads run efficiently and fast, reducing ...

With doubled I/O interfaces and refined low voltage TSV design, HBM4 reshapes how memory stacks sustain throughput under data ...

AI doesn't just need memory; it also needs massive storage capacity. Western Digital is a leader in developing advanced 3D ...

Per-stack total memory bandwidth has increased by 2.7-times versus HBM3E, reaching up to 3.3 Tb/s. With 12-layer stacking, Samsung is offering HBM4 in capacities from 24 gigabytes (GB) to 36 GB, and ...

Samsung Electronics announced Thursday it had started mass production of next-generation memory chips to power artificial ...

Company plans to start shipping HBM4 chips after Lunar New Year holiday, for use in graphics processing units - Anadolu Ajansı ...

Micron has been one of the biggest winners in the AI boom.

Western Digital is introducing a couple of new technologies, dubbed "High Bandwidth Drive" and "Dual Pivot", that will significantly boost the performance of hard drives. According to Western Digital, ...