The global High Bandwidth Memory (HBM) market is experiencing explosive growth driven by AI demand. The industry is heavily investing in 3D-stacked memory architecture (TSV technology) and advanced ...

SPHBM4 cuts pin counts dramatically while preserving hyperscale-class bandwidth performance Organic substrates reduce packaging costs and relax routing constraints in HBM designs Serialization shifts ...

With doubled I/O interfaces and refined low voltage TSV design, HBM4 reshapes how memory stacks sustain throughput under data ...

JEDEC Solid State Technology Association, the global leader in standards development for the microelectronics industry, today announced it is nearing completion of a new standard for Standard Package ...

"Locked" and loaded.

Samsung has started mass production and shipment of its HBM4 chips, which are 46% faster than the industry standard.

Samsung starts mass production of HBM4 memory with up to 3.3 TB/s bandwidth, 40% better efficiency, and confirmed AI GPU ...

Per-stack total memory bandwidth has increased by 2.7-times versus HBM3E, reaching up to 3.3 Tb/s. With 12-layer stacking, Samsung is offering HBM4 in capacities from 24 gigabytes (GB) to 36 GB, and ...

Samsung Electronics will begin shipments of its next-generation high bandwidth memory, HBM4, after the Lunar New Year holiday ...

Micron—which recently decided to exit the consumer RAM and storage markets but is still selling its products to other businesses—also reported a big boost to net income year over year, from $1.87 ...