The rapid advancement of artificial intelligence (AI) is driving unprecedented demand for high-performance memory solutions. AI-driven applications are fueling significant year-over-year growth in ...

Samsung moves up its HBM4 production schedule and begins preparing for mass output of next generation high bandwidth memory chips. Nvidia chooses Samsung, not Micron Technology (NasdaqGS:MU), as a ...

Western Digital is introducing a couple of new technologies, dubbed "High Bandwidth Drive" and "Dual Pivot", that will significantly boost the performance of hard drives. According to Western Digital, ...

NVIDIA, the dominant player in AI semiconductors, has reportedly requested Samsung Electronics to expedite the supply of its 6th-generation high-bandwidth memory (HBM4). Samsung is currently ...

Samsung Electronics' sixth-generation high-bandwidth memory, HBM4, has reportedly posted the fastest operating speeds in a key technology test run by Broadcom. The results strengthen the company's ...

Per-stack total memory bandwidth has increased by 2.7-times versus HBM3E, reaching up to 3.3 Tb/s. With 12-layer stacking, Samsung is offering HBM4 in capacities from 24 gigabytes (GB) to 36 GB, and ...

High-bandwidth memory, or HBM, has become one of the most lucrative niches in semiconductors, benefiting from explosive demand linked to AI model training and inference. As capacity tilts toward HBM, ...

SPHBM4 cuts pin counts dramatically while preserving hyperscale-class bandwidth performance Organic substrates reduce packaging costs and relax routing constraints in HBM designs Serialization shifts ...

TL;DR: SK hynix is developing High Bandwidth Storage (HBS), combining mobile DRAM and NAND in a single package using innovative Vertical Wire Fan-Out (VFO) technology. This multi-layer stacked memory ...