SAP enables AT&S to manufacture printed circuit boards and IC substrates of a size and complexity that almost rivals products from the semi-conductor industry. mSAP stands for “modified semi-additive ...
Image transfer, also known as photolithography (or simply, lithography), plays a crucial role in defining the circuit patterns on a panel. With photolithography, IC substrate manufacturers can ...
TOKYO--(BUSINESS WIRE)--Shin-Etsu Chemical Co., Ltd. (TOKYO: 4063) (Head Office: Tokyo; President: Yasuhiko Saitoh; hereinafter, “Shin-Etsu Chemical”) has developed equipment to manufacture ...
Major processes in semiconductor wafer fabrication: 1) wafer preparation, 2) pattern transfer, 3) doping, 4) deposition, 5) etching, and 6) packaging. The process of creating semiconductors can be ...
New portfolio drives chip performance with panel-based interconnect innovation KLA is extending the capability of the proven Corus™ direct imaging platform and introducing the Serena™ direct imaging ...
SEOUL, Dec. 10 (Yonhap) -- LG Innotek Co., a major South Korean electronics parts maker, has developed a next-generation smart integrated circuit (IC) substrate that cuts carbon emissions during the ...
BOSTON, MA, UNITED STATES, February 18, 2025 /EINPresswire.com/ -- UniversityWafer, Inc., a global leader in advanced semiconductor substrates, is proud to announce ...
DOWNERS GROVE, Ill., Oct. 29, 2025 /PRNewswire/ -- Malema™, part of PSG and Dover (NYSE: DOV) and a leading provider of flow meter technologies for use in industrial and semiconductor applications, ...
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