Wire bonding is widely used in electronic devices, the semiconductor industry, and microelectronics. It enables interconnections between the die and other electronic components in an integrated ...

Three-dimensional stacked integrated circuits (3D-ICs) are composed of multiple stacked die, and are viewed as critical in helping the semiconductor industry keep pace with Moore’s Law. Current ...

The testing of the semiconductor dies produced by a wafer fabrication plant involves a long series of operations requiring meticulous care. The time spent performing these tests markedly affects both ...

As chips become more heterogeneous with more integrated functionality, testing them presents increasing challenges — particularly for high-speed system-on-chip (SoC) designs with limited test pin ...

Mentor, a Siemens business, has introduced Tessent Connect, a design-for-test (DFT) automation methodology that delivers intent-driven hierarchical test implementation that helps IC design teams ...

Semiconductor test equipment leader Chroma ATE announced that its founder and chairman, Leo Huang, will step down as CEO, handing the role over to I-Shih Tseng, the current president... Semiconductor ...