The U.S. Department of Defense (DoD) celebrated a milestone achievement for the State-of-the-Art (SOTA) Heterogeneous Integrated Packaging (SHIP) Program with the delivery of the first SHIP prototype ...

The field of fluid dispensing and microelectronics packaging is at the forefront of technological innovation, merging precise fluid delivery systems with the intricate assembly of semiconductor ...

Microelectronics has been a hot topic in technology circles in recent years. Although the CHIPS and Science Act is a main driver of the latest resurgence, the defense industrial base’s reliance on ...

In pursuit of more powerful microelectronic systems, more powerful microchips must be packaged closer together, with more robust connections – the same is true for the research partnership to achieve ...

BUFFALO, N.Y. -- Some of the world's most advanced research in micro- and nanoelectronic-packaging reliability is taking place in the Electronic Packaging Laboratory in the University at Buffalo ...

WEST LAFAYETTE, Ind. — Purdue University, a national leader in microelectronics research and workforce development, will host a workshop to discuss challenges and opportunities related to the future ...

The Department of Commerce is investing up to $300 million to accelerate the development of technologies to boost the semiconductor industry. The department said Thursday the three entities receiving ...

A s part of the CHIPS for America program, the U.S. Department of Commerce (DOC) is entering negotiations to invest up to $300 million in advanced packaging research projects in Georgia, California, ...

Medical devices are increasingly defined by the microelectronics inside them. Miniaturized sensors, embedded computing, and advanced packaging are enabling devices that are smaller, smarter, more ...

While the capabilities of electronic microchips used for cellphones, computers, infrastructure and vehicles have advanced in recent years, researchers say the development of new microelectronic ...

Increasingly, memory chips—in combinations of all their flavors, including DRAM, SRAM, and flash—are at the forefront of microelectronics end-product functions. This scenario is true for cell-phone ...