An estimated 30% of companies are leveraging artificial intelligence today and 70% see the greatest impact in the packaging design stage, market analysis and interviews with Consumer Goods Forum ...

Packaging has always been a balancing act. Consumer packaged goods (CPG) companies must weigh cost versus performance and market appeal versus machinability. As interest in sustainable packaging has ...

A report from The Consumer Goods Forum's Plastic Waste Coalition of Action asserts that artificial intelligence can help ...

Industrial applications will acquire significantly more data directly from machines in coming years. To properly handle this increase in data, it must already be prepared at the machine. The data of ...

Randy Ludacer likes tweaking classics. As a graphic and packaging designer, he’s designed a package for coat hangers that resembles a shirt, a puzzle cube-like box that holds souvenir candies, and a ...

SUNNYVALE, Calif.--(BUSINESS WIRE)--Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711), today announced the launch of IDE 2.0, a ...

A new IEEE technical paper titled “Package Assembly Design Kits (PADK’s)- The Future of Advanced Wafer-Level Manufacturing” was written by researchers from Amkor. Find the technical paper here.

For many applications, next generation IC packaging is the best path to achieve silicon scaling, functional density, and heterogeneous integration while reducing the overall package size.

Fairchild Capital Partners has acquired Buffalo, New York-based Package Design & Supply Co., Inc, a maker of industrial and business packaging and shipping products and supplies. No financial terms ...