System-in-Package (SiP) technology has been used for a wide range of electronic devices, but the warpage behavior of the package can be difficult to control and predict due to complex manufacturing ...

The transfer molded DIP-IPM was first introduced in 1998 to address the rapidly growing demand for cost-effective motor control in consumer appliance applications. These devices soon became widely ...

Could you give us a brief history of Neu Dynamics? Kevin Hartsoe, President, Neu Dynamics/NDC International: Neu Dynamics was founded in 1972 as an engraving and stamping die shop that eventually ...

Toyota Motor Corp. has added more carbon fiber production capacity in house, and it's not just for supercars and not just about cutting weight. Core Molding Technologies Inc. is expanding its ...