KIC, a renowned pioneer in thermal process and temperature measurement solutions for electronics manufacturing, is excited to announce its participation in the 2024 IPC APEX EXPO, scheduled to take ...

Nowadays, there are many interconnects in IC chips. One of the packaging goals is to connect an IC to the next level of subsystem circuitry (package substrates/print circuit boards). Mass reflow (MR) ...

Advancements in design processes are said to be responsible for the 236 series terminal blocks' ability to adapt to the solder reflow process. In particular, the series employs an optimized pin length ...

This paper describes the losses from defects at the placement process in the SMT line. Two case studies of European and Taiwanese SMT manufacturers illustrate the actual losses from their defects. An ...