The small and complicated features of TSVs give rise to different defect types. Defects can form during any of the TSV ...

Full-blown process excursions that affect every wafer are comparatively easy for fabs to detect and fix. However, “onesie-twosie,” lower-volume excursions can go unresolved for months or even years.

Strontium titanate is a material of considerable interest for electronic applications. A recent study revealed that strontium titanate (STO) annealed in strontium oxide (SrO) powder exhibits large ...

Positron Annihilation Spectroscopy (PAS) is a highly sensitive, non-destructive method for probing atomic-scale imperfections in a broad spectrum of materials, from metals and ceramics to polymers and ...