ACM Research Receives Multiple Advanced Packaging Equipment Orders from Leading Global Customers

Detailed price information for Acm Research Inc (ACMR-Q) from The Globe and Mail including charting and trades.
Digi Times

ACE: Wafer-level packaging and testing ready for take-off

Advanced Chip Engineering Technology (ACE) has successfully run wafer-level packaging and testing for an 8-inch wafer of 64Mbit DRAM. The company has already acquired technical certification for its ...
Seeking Alpha

ACM Research Expands Advanced Packaging Portfolio with Introduction of Frame Wafer Cleaning Tool

FREMONT, Calif., May 08, 2024 (GLOBE NEWSWIRE) -- ACM Research, Inc. (ACMR) (“ACM”) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level ...
Nasdaq

ACM Research Enters Fan-out Panel Level Packaging Market with Introduction of Ultra C vac-p Flux Cleaning Tool for Chiplets

FREMONT, Calif., July 29, 2024 (GLOBE NEWSWIRE) -- ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging ...
Digi Times

NEWS TAGGED WAFER-LEVEL PACKAGING

Advanced Chip Engineering (ACE), a wafer-level packaging and testing house which has investment from King Yuan Electronics Company (KYEC), suffered a fire on the second floor of a... STATS ChipPAC has ...
Semiconductor Engineering

Advanced Packaging Limits Come Into Focus

Moore’s Law has shifted toward advanced packaging over the past few years, but the limits of that approach are just now coming into focus. AI and HPC designs are growing larger ...
Seeking Alpha

NVE outlines accelerated growth plans with in-house wafer-level chip scale packaging and 4% sequential revenue increase

CEO Daniel Baker reported a 4% sequential increase in revenue for the quarter, highlighting strong increases in distributor and nondefense sales, despite an expected decrease in defense sales. Baker ...
WPRI 12

CoreFlow Ltd. Introduces GripJet™: The Next-Generation Vacuum Chuck for Warped Wafer Gripping and Flattening at Advanced Semiconductor Wafer-Level Packaging Processes

CoreFlow Ltd. is proud to unveils its groundbreaking GripJet™ vacuum chuck, a revolutionary solution for advanced wafer-level packaging (AWLP) and other processes. By Eliminating the need for soft-pad ...
Business Insider

ClassOne Technology Expands Solstice® Single-Wafer Portfolio with New 300mm Solstice Max Platform for Advanced Packaging Metallization

PHOENIX, Oct. 07, 2025 (GLOBE NEWSWIRE) -- SEMICON WEST -- ClassOne Technology, a leading global provider of advanced electroplating and wet processing tools for microelectronics manufacturing, today ...
USA Today

Silicon Box Ships 100M Units, Proves Advanced Panel-Level Packaging Ready for AI, HPC era

Breakthrough yield and device performance at high volume show team can scale company’s large-format advanced packaging for customers’ cutting-edge applications SINGAPORE, SG / ACCESS Newswire / ...
Nasdaq

Silicon Box cutting-edge, advanced panel-level packaging foundry announces $3.6B investment for expansion into Italy

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