Finding critical defects in manufacturing is becoming more difficult due to tighter design margins, new processes, and shorter process windows. Process marginality and parametric outliers used to be ...

In the world of embedded software development, defects can cripple projects, delay releases, and ultimately lead to failures that affect everything from consumer electronics to mission-critical ...

AI plays a role in improving defect capture rate and distinguishing between yield-killing and nuisance defects. New developments in wafer edge inspection are proving essential to bonded wafer yields.