Fan-out wafer-level packaging (FOWLP) is becoming a critical technology in advanced semiconductor packaging, marking a ...

AI can optimize patterns, but only humans can create connection.

When AI teams deliberately and carefully design their training datasets, they can actively reduce bias, mitigate risk and ...

A few years ago, I had lunch with the head of a major motion picture studio, who declared that his central problem was not finding good people—it was finding good ideas. Since then, when giving talks, ...