Abstract: Thermosonic flip chip bonding is used in certain fine pitch IC packaging for its unique features. By using this bonding process in this paper, 1 mm times 1 mm chip with 8 gold bumps has been ...
Abstract: In this paper, a multichannel instrumentation system for the location of partial discharges (PDs) in power transformers is presented. It is based on the detection of the acoustic emissions ...
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