Abstract: A large silicon chip or interposer is mounted onto a large package substrate using flip-chip for high performance computing (HPC) such as artificial intelligence (AI) and fifth generation ...
Abstract: We present a 256×256 in-memory compute (IMC) core designed and fabricated in 14nm CMOS with backend-integrated multi-level phase-change memory (PCM). It comprises 256 linearized current ...
SAP Cloud SDK for AI is the official Software Development Kit (SDK) for SAP AI Core, SAP Generative AI Hub, and Orchestration Service. This SDK enables developers to seamlessly integrate AI ...
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