Use these structured prompting techniques to improve the quality and usefulness of AI output in testing workflows ...

If you're leading a team in 2026, use this easy AI workflow to halve your prep and post-meeting time, and boost your ...

Abstract: Molding process of packages is the key link in IC packages and test. Epoxy resin is melted to fill into a specific mold to coat the chip. Filling the cavity with dissatisfaction will lead to ...