STMicroelectronics has unveiled the STM32WL3R, a new wireless microcontroller designed to improve battery life and efficiency ...

Codasip has entered into a strategic licensing agreement with EnSilica to supply its CHERI-enabled embedded CPU.

TTI Europe expands its automotive offering with the introduction of TE Connectivity’s GEMnet connector system.

Manufacturing & Engineering North East returns this month for its third edition, marking another milestone for a show that ...

The expansion of the Maxnetic® product line, now with .100” pitch options, delivers next-generation high reliability magnetic ...

Taoglas has rolled out significant updates to its Antenna Integrator tool, part of the AntennaXpert suite, aimed at improving ...

To ensure comfort during extended procedures, Snke collaborated with Lumus and manufacturing partner Quanta to optimise lens ...

CEA-Leti has announced plans to launch a multilateral programme aimed at advancing microLED technology for ultra-fast data ...

GUC and Ayar Labs to advance the integration of co-packaged optics (CPO) into next-generation computing systems.

Automation and smart-factory technologies dominated many of the discussions held at productronica 2025, reflecting the ...

Th EU has announced that enforcement of the strictest parts of the AI Act will now be pushed back to December 2027.

Farnell, part of Avnet, has introduced The DevKit HQ, an online platform designed to simplify access to evaluation boards, ...