Advanced Packaging Services - Taiwan Semiconductor Manufacturing Company Limited
Advanced Packaging Services - Taiwan Semiconductor Manufacturing Company Limited
Nov 3, 2020
tsmc.com
Rethink LED encapsulation. SIPA 3052 is designed for LED packaging, offering fast curing and quick demolding for efficient production. ✔ Rapid cure, fast demold ✔ High transparency, non-yellowing ✔ Lighter than glass ✔ No glass housing required — lower cost, higher efficiency Smarter LED encapsulation starts here #ledencapsulant #ledpotting #siliconeadhesive #pottingadhesive #SealantFactory #elaplusadhesive | Elaplus Functional Material Shanghai Co., Ltd.
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Rethink LED encapsulation. SIPA 3052 is designed for LED packaging, offering fast curing and quick demolding for efficient production. ✔ Rapid cure, fast demold ✔ High transparency, non-yellowing ✔ Lighter than glass ✔ No glass housing required — lower cost, higher efficiency Smarter LED encapsulation starts here #ledencapsulant #ledpotting #siliconeadhesive #pottingadhesive #SealantFactory #elaplusadhesive | Elaplus Functional Material Shanghai Co., Ltd.
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FacebookElaplus Functional Material Shanghai Co., Ltd.
Intel Leads the Way with Advanced Packaging
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Advanced packaging is the next wave of semiconductor innovation, meeting the growing demands of AI and enhancing chip performance. Discover how we push the boundaries with our advanced packaging tools and techniques to shape the future of chip design. https://bit.ly/42GBLwW | Lam Research Corporation
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Advanced packaging is the next wave of semiconductor innovation, meeting the growing demands of AI and enhancing chip performance. Discover how we push the boundaries with our advanced packaging tools and techniques to shape the future of chip design. https://bit.ly/42GBLwW | Lam Research Corporation
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