How advanced packaging technologies enable next-gen computing | Lam Research posted on the topic | LinkedIn
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1.6K views · 71 reactions | In the fast-paced world of semiconductors, there's always engineering problems to solve that require a high degree of collaboration and teamwork. Check out our video to learn how Lam engineers tackle them! Speaking of, we’re excited to celebrate Engineering Week next week - stay tuned for some fun posts. | Lam Research Corporation | Facebook
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Our cryogenic dielectric etch technology—Lam Cryo 3.0—delivers enhanced etch rates, vertical high aspect ratio (HAR) profiles, and more. Learn how Lam Cryo 3.0 is optimized to manufacture next-generation 3D NAND devices with 400 layers and beyond from Group VP and GM of Etch Product Group, Harmeet Singh. https://bit.ly/3yCkBVv | Lam Research Corporation
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The semiconductor industry is bringing 3D advanced packaging concepts into production — are you ready? Discover how we ensure advanced packaging achieves commercial success. https://bit.ly/4dWuJYT | Lam Research Corporation
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Class is in session! 📚🎒 Today’s lesson is on High Bandwidth Memory manufacturing — made possible by advanced packaging technologies like Syndion® etch and SABRE 3D®. Discover how through silicon vias (TSVs) are created to allow memory to function as a high-speed contiguous unit. ⬇️ https://bit.ly/47ekrAC | Lam Research Corporation
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3.3K views · 62 reactions | Our cutting-edge advanced packaging technologies make High Bandwidth Memory (HBM) a reality for #GenAI devices. Discover why solutions like 2.5D and 3D integration are critical for enabling the third generation of HBM and providing high-speed access to vast data sets for #AI training. https://bit.ly/47ekrAC | Lam Research Corporation | Facebook
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